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INTEGRATED CIRCUITS
DATA SHEET
74LVC2244A Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
Product specification File under Integrated Circuits, IC24 1999 Sep 30
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
FEATURES * 5 V tolerant inputs/outputs for interfacing with 5 V logic * Wide supply voltage range of 1.2 to 3.6 V * CMOS low power consumption * Direct interface with TTL levels * Integrated 30 termination resistors. DESCRIPTION
74LVC2244A
The 74LVC2244A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation, outputs can handle 5 V. These features allow the use of these devices as translators in a mixed 3.3/5 V environment. The 74LVC2244A is an octal non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise and fall times. The 74LVC2244A is designed with 30 series termination resistors in both HIGH and LOW output stages to reduce line noise.
QUICK REFERENCE DATA Ground = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH CI CPD Note 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; (CL x VCC2 x fo) = sum of the outputs. PARAMETER propagation delay 1An to 1Yn; 2An to 2Yn input capacitance power dissipation capacitance per buffer VI = GND to VCC; note 1 CONDITIONS CL = 50 pF; VCC = 3.3 V TYPICAL 4.0 5.0 25 ns pF pF UNIT
1999 Sep 30
2
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
FUNCTION TABLE See note 1. INPUT nOE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGE OUTSIDE NORTH AMERICA 74LVC2244AD 74LVC2244ADB 74LVC2244APW PINNING PIN 1 2, 4, 6, 8 3, 5, 7, 9 10 11, 13, 15, 17 12, 14, 16, 18 19 20 1OE 1A0 to 1A3 2Y0 to 2Y3 GND 2A3 to 2A0 1Y3 to 1Y0 2OE VCC SYMBOL data inputs bus outputs ground (0 V) data inputs bus outputs output enable input (active LOW) DC supply voltage DESCRIPTION output enable input (active LOW) NORTH AMERICA 74LVC2244AD 74LVC2244ADB 74LVC2244APW DH TEMPERATURE RANGE -40 to +85 C PINS 20 20 20 PACKAGE SO SSOP TSSOP nAn L H X
74LVC2244A
OUTPUT nYn L H Z
MATERIAL plastic plastic plastic
CODE SOT163-1 SOT339-1 SOT360-1
1999 Sep 30
3
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC2244A
handbook, halfpage
1OE 1 1A0 2 2Y0 3 1A1 4 2Y1 5 1A2 6 2Y2 7 1A3 8 2Y3 9 GND 10
MNA357
20 VCC 19 2OE 18 1Y0 17 2A0 16 1Y1
2244
15 2A1 14 1Y2 13 2A2 12 1Y3 11 2A3 6 1A2 1Y2 14
handbook, halfpage
2
1A0
1Y0
18
4
1A1
1Y1
16
8
1A3 1OE
1Y3
12
Fig.1 Pin configuration.
1
17
2A0
2Y0
3
15
2A1
2Y1
5
handbook, halfpage
1
13 EN 18 16 14 12 19 11
2A2
2Y2
7
2A3 2OE
2Y3
2 4 6 8
9
MNA360
19
EN 3 5 7 9
MNA359
17 15 13 11
Fig.3 IEC logic symbol.
Fig.2 Functional diagram.
1999 Sep 30
4
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage for max. speed performance for low-voltage applications VI VO DC input voltage DC output voltage output HIGH or LOW state 3-state Tamb tr,tf operating ambient temperature input rise and fall times see DC and AC characteristics per device VCC = 1.2 to 2.7 V VCC = 2.7 to 3.6 V 0 0 -40 0 0 2.7 1.2 0 CONDITIONS
74LVC2244A
MIN.
MAX. 3.6 3.6 5.5 VCC 5.5 +85 20 10
UNIT V V V V V C ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage output HIGH or LOW output 3-state IO ICC, IGND Tstg Ptot DC output diode current DC VCC or GND current storage temperature power dissipation per package plastic mini-pack (SO) note 2 - - 500 500 mW mW plastic shrink mini-pack (SSOP and note 3 TSSOP) Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO package: above 70 C the value of Ptot derates linearly with 8 mW/K. 3. For SSOP and TSSOP package: above 60 C the value of Ptot derates linearly with 5.5 mW/K. note 1 note 1 VO = 0 to VCC -0.5 -0.5 - - -65 VCC + 0.5 +6.5 50 100 +150 V V mA mA C VI < 0 note 1 VO > VCC or VO < 0 CONDITIONS MIN. -0.5 - -0.5 - MAX. +6.5 -50 +5.5 50 UNIT V mA V mA
1999 Sep 30
5
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL; IO = -6 mA VI = VIH or VIL; IO = -12 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 6 mA VI = VIH or VIL; IO = 100 A VI = VIH or VIL; IO = 12 mA II IOZ Ioff ICC ICC Note 1. All typical values are at VCC = 3.3 V and Tamb = 25 C. input leakage current 3-state output OFF-state current power off leakage supply quiescent supply current additional quiescent supply current per control pin VI = 5.5 V or GND VI = VIH or VIL; VO = 5.5 V or GND VI or VO = 5.5 V VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0 VCC (V) 1.2 1.2 2.7 3.0 2.7 3.0 3.0 3.6 3.6 0.0 3.6 MIN. VCC -
74LVC2244A
Tamb (C) -40 to +85 TYP.(1) MAX. - - - - - - GND 0.8 - - - 0.40 0.20 0.55 5 10 10 20 500 A A A A A V V V V UNIT
2.7 to 3.6 2.0 2.7 to 3.6 - VI = VIH or VIL; IO = -100 A 3.0
VCC - 0.5 - VCC - 0.2 VCC VCC - 0.8 - - - - - - - - - - - 0.1 0.1 0.1 0.1 5
2.7 to 3.6 -
1999 Sep 30
6
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
AC CHARACTERISTICS Ground = 0 V; tr = tf 2.5 ns. SYMBOL tPHL/tPLH tPZH/tPZL tPHZ/tPLZ Note 1. Typical values at VCC = 3.3 V and Tamb = 25 C. AC WAVEFORMS PARAMETER propagation delay 1An to 1Yn; 2An to 2Yn 3-state output enable time 1OE to 1Yn; 2OE to 2Yn 3-state output disable time 1OE to 1Yn; 2OE to 2Yn WAVEFORMS see Figs 4 and 6 see Figs 5 and 6 see Figs 5 and 6 1.5 1.5 1.5 VCC = 3.3 0.3 V MIN. TYP.(1) 4.0 4.4 3.8 MAX. 6.5 8.1 5.4
74LVC2244A
VCC = 2.7 V MIN. 1.5 1.5 1.5 MAX. 7.5 9.1 6.4
UNIT ns ns ns
handbook, halfpage VI
1An, 2An input GND tPHL VOH 1Yn, 2Yn output VOL
VM
tPLH
VM
MNA361
VM = 1.5 V at VCC 2.7 V; VM = 0.5 VCC at VCC < 2.7 V; VOL and VOH are typical output voltage drop that occur with the output load.
Fig.4 The input nAn to output nYn propagation delays.
1999 Sep 30
7
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC2244A
handbook, full pagewidth
VI nOE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
MNA362
Fig.5 The 3-state enable and disable times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO RL 500
2 x VCC open GND
MNA368
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND VCC <2.7 V 2.7 to 3.6 V VI VCC 2.7 V
Definitions for test circuit: RL = Load resistor CL = Load capacitance including jig and probe capacitance (see Chapter "AC characteristics"). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.6 Load circuitry for switching times.
1999 Sep 30
8
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm
74LVC2244A
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1999 Sep 30
9
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC2244A
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1999 Sep 30
10
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
74LVC2244A
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153AC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-06-16 95-02-04 A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 0o
o
1999 Sep 30
11
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74LVC2244A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Sep 30
12
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
74LVC2244A
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Sep 30
13
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
NOTES
74LVC2244A
1999 Sep 30
14
Philips Semiconductors
Product specification
Octal buffer/line driver with 30 series termination resistors; 5 V input/output tolerant; 3-state
NOTES
74LVC2244A
1999 Sep 30
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 1999
Sep 30
Document order number:
9397 750 05623

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